Dimensity 9500 detailed specifications leaked well before launch, promises top-notch performance

Qualcomm is expected to unveil its next flagship chip, the Snapdragon 8 Elite 2, by September this year . This chipset will face competition from MediaTek’s Dimensity 9500, which may debut around the same time. Today, reliable tipster Digital Chat Station released a Weibo post to share the key specifications of the D9500 chip.

According to the tipster, the Dimensity 9500 will be built on TSMC’s advanced N3P process and will feature a completely new large-core CPU setup. The CPU configuration includes one Travis core, three Alto cores, and four Gelas cores. Travis and Alto are said to be based on ARM’s latest Cortex-X9 series, supporting SME instruction sets, while Gelas represents a new generation of A7 series large cores.



This marks a shift from the previous Dimensity 9400, which relied on Cortex-X4 cores. The chip also includes 16MB of L3 cache and 10MB of SLC cache. Memory support extends to quad-channel LPDDR5x RAM with speeds up to 10,667Mbps, alongside four-lane UFS 4.

1 storage compatibility. The GPU, known as Immortalis-Drage, is designed with a new microarchitecture to significantly improve ray tracing capabilities while lowering power consumption. Additionally, the NPU 9.

0 is expected to deliver AI processing power of up to 100TOPS. While the Dimensity 9400 achieved commendable scores—around 2840000 points on AnTuTu benchmarks—the Dimensity 9500 is expected to take things much further. According to industry insiders, the new chip’s benchmark scores could exceed 4,000,000 mark on AnTuTu .

Rumors are rife that the Vivo X300 series and the Oppo Find X9 lineup will be the first devices to feature the Dimensity 9500 chip. The tipster also revealed the existence of a new Dimensity 8-series chip dubbed the Dimensity 8450. However, he did not share any information about its specifications.

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