2 weeks Ago By Korea Bizwire
Hanmi Semiconductor’s “Dedicated A/S Team for SK hynix” (Image provided by Hanmi Semiconductor) SEOUL, April 22 (Korea Bizwire) — As SK hynix accelerates its push to expand high-bandwidth memory (HBM) production, the company is working to stabilize its supply of a critical manufacturing tool — the thermal compression (TC) bonder — by diversifying its vendor base. The move comes amid a global surge in demand for HBM, driven largely by artificial intelligence applications. Industry sources confirmed that in March 2025, SK hynix signed contracts with Hanwha Semitec for approximately 10 TC bonders worth 42 billion won (about $31 million), marking a strategic shift from its traditional reliance on Hanmi Semiconductor, its longtime equipment partner.
The diversification aims to reduce supply risks and meet rapidly growing demand for HBM products, including the cutting-edge 12-layer HBM3E chips. While the decision enhances supply chain resilience, it has reportedly stirred tensions. Hanmi Semiconductor, which co-developed TC bonders with SK hynix in 2015 and has supplied them since 2017, expressed dissatisfaction with what it viewed as an abrupt and poorly communicated dual-sourcing move.
The situation is further complicated by an unresolved patent infringement lawsuit Hanmi filed against Hanwha Semitec late last year over TC bonder technology. The TC bonder is an essential piece of equipment in HBM manufacturing, used to thermally fuse stacked DRAM layers. With SK hynix leading the global HBM market, timely access to this equipment is critical.
Analysts note that vendor diversification is a necessary hedge against risks such as pricing pressures, supply delays, and geopolitical disruptions. In response to the shift, Hanmi Semiconductor is reportedly seeking to mend ties. SK hynix executives recently visited Hanmi’s Incheon headquarters to reaffirm the partnership, indicating that the company intends to maintain relationships with both suppliers rather than favor one exclusively.
Hanmi Semiconductor’s “TC Bonder” Equipment (Image provided by Hanmi Semiconductor) “From a business perspective, vendor diversification is routine, especially in high-stakes markets like semiconductors,” said one industry expert. “Just as Nvidia seeks HBM supply from SK hynix, Samsung, and Micron to reduce dependency, SK hynix is ensuring its own supply chain resilience.” Hanmi Semiconductor is also expanding its customer base.
During its preliminary Q1 2025 earnings release on March 31, the company revealed that 90% of its first-quarter revenue came from overseas clients. Key customers include SK hynix and U.S.
-based Micron, which is said to have already ordered more TC bonders in early 2025 than it did in all of 2024. As SK hynix prepares to release its first-quarter earnings on April 24, market watchers are keen to see whether the company will address ongoing negotiations and future orders for TC bonders. Meanwhile, Hanmi Semiconductor postponed a scheduled investor relations briefing from April 22 to mid-May, citing the need to wait for finalized quarterly results.
Industry observers speculate that the delay may also reflect sensitivity around its evolving relationship with SK hynix. As HBM demand continues to climb in 2025, the dynamics between chipmakers and equipment suppliers are evolving rapidly — with strategic partnerships, legal disputes, and supply chain strategies all converging at the heart of the AI-fueled semiconductor race. Kevin Lee (kevinlee@koreabizwire.
com).
